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1 Ergebnisse
1
Comparison and evaluation of the thermal performance betwee..:
, In:
2022 IEEE Transportation Electrification Conference and Expo, Asia-Pacific (ITEC Asia-Pacific)
,
Tang, Cheng
;
Xu, Qianming
;
Han, Rong
... - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ITECAsia-Pacific56316.2022.994..
RT T1 <cTitle>2022 IEEE Transportation Electrification Conference and Expo, Asia-Pacific (ITEC Asia-Pacific)</cTitle>: T1 <Title>Comparison and evaluation of the thermal performance between SiC-MOSFET and Si-IGBT</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9941944&Exemplar=1&LAN=DE A1 Tang, Cheng A1 Xu, Qianming A1 Han, Rong A1 Guo, Peng A1 Liu, Rui A1 Qing, Zhuo YR 2022 K1 Temperature distribution K1 Thermometers K1 Thermal resistance K1 Switching frequency K1 Thermal engineering K1 Multichip modules K1 Transportation K1 Thermal performance K1 SiC-MOSFET K1 Si-IGBT K1 junction temperature swing K1 thermal platform SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ITECAsia-Pacific56316.2022.9941944 DO https://doi.org/10.1109/ITECAsia-Pacific56316.2022.9941944 SF ELIB - SuUB Bremen
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