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Interconnect Modeling using a Surface Admittance Operator D..:

, In: 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Bosman, Dries ; Huynen, Martijn ; De Zutter, Daniel... - p. 1-3 , 2022
Link: https://doi.org/10.1109/EPEPS53828.2022.9947108