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1 Ergebnisse
1
Signal Integrity and Power Leakage Optimization for 3D X-Po..:
, In:
2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
,
Son, Kyungjune
;
Kim, Keunwoo
;
Park, Gapyeol
... - p. 1-3 , 2022
Link:
https://doi.org/10.1109/EPEPS53828.2022.9947197
RT T1 <cTitle>2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)</cTitle>: T1 <Title>Signal Integrity and Power Leakage Optimization for 3D X-Point Memory Operation using Reinforcement Learning</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9947197&Exemplar=1&LAN=DE A1 Son, Kyungjune A1 Kim, Keunwoo A1 Park, Gapyeol A1 Lho, Daehwan A1 Park, Hyunwook A1 Sim, Boogyo A1 Shin, Taein A1 Park, Joonsang A1 Kim, Haeyeon A1 Kim, Joungho A1 Gong, Kyubong YR 2022 SN 2165-4115 K1 Solid modeling K1 Analytical models K1 Three-dimensional displays K1 Integrated circuit interconnections K1 Reinforcement learning K1 Manufacturing K1 Integrated circuit modeling K1 3D X-Point memory K1 power leakage K1 reinforcement learning K1 signal integrity (SI) SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/EPEPS53828.2022.9947197 DO https://doi.org/10.1109/EPEPS53828.2022.9947197 SF ELIB - SuUB Bremen
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