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1 Ergebnisse
1
Electrothermal Ruggedness of High Voltage SiC Merged-PiN-Sc..:
, In:
2022 IEEE Energy Conversion Congress and Exposition (ECCE)
,
Shen, Chengjun
;
Jahdi, Saeed
;
Yang, Juefei
... - p. 1-7 , 2022
Link:
https://doi.org/10.1109/ECCE50734.2022.9948045
RT T1 <cTitle>2022 IEEE Energy Conversion Congress and Exposition (ECCE)</cTitle>: T1 <Title>Electrothermal Ruggedness of High Voltage SiC Merged-PiN-Schottky Diodes Under Inductive Avalanche & Surge Current Stress</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9948045&Exemplar=1&LAN=DE A1 Shen, Chengjun A1 Jahdi, Saeed A1 Yang, Juefei A1 Alatise, Olayiwola A1 Ortiz-Gonzalez, Jose A1 Mellor, Phil YR 2022 SN 2329-3748 K1 Temperature measurement K1 Schottky diodes K1 Temperature distribution K1 Silicon carbide K1 PIN photodiodes K1 Current measurement K1 Energy measurement K1 Silicon Carbide (SiC) K1 Junction Barrier Schottky K1 Merged PiN Schottky K1 Avalanche K1 Surge Current SP 1 OP 7 LK http://dx.doi.org/https://doi.org/10.1109/ECCE50734.2022.9948045 DO https://doi.org/10.1109/ECCE50734.2022.9948045 SF ELIB - SuUB Bremen
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