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1 Ergebnisse
1
The mechanical reliability design of thin-film encapsulatio..:
, In:
2022 IEEE International Flexible Electronics Technology Conference (IFETC)
,
Huang, Sixin
;
Long, Haohui
;
Li, Jianhui
.. - p. 1-6 , 2022
Link:
https://doi.org/10.1109/IFETC53656.2022.9948535
RT T1 <cTitle>2022 IEEE International Flexible Electronics Technology Conference (IFETC)</cTitle>: T1 <Title>The mechanical reliability design of thin-film encapsulation for laminated-based flexible organic light emitting diodes using semi-analytical method</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9948535&Exemplar=1&LAN=DE A1 Huang, Sixin A1 Long, Haohui A1 Li, Jianhui A1 Fang, Jianping A1 Gao, Jiaying YR 2022 K1 Encapsulation K1 Tensile stress K1 Manufacturing processes K1 Organic light emitting diodes K1 Reliability engineering K1 Mathematical models K1 Finite element analysis K1 Flexible organic light emitting diodes K1 Thin-film encapsulation K1 Internal stress K1 Defects fracture toughness K1 Semi-analytical mechanical method SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/IFETC53656.2022.9948535 DO https://doi.org/10.1109/IFETC53656.2022.9948535 SF ELIB - SuUB Bremen
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