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1 Ergebnisse
1
Thermal-Hydraulic Characterisation of Electronics Cooling L..:
, In:
2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
,
Murray, G.
;
Elliott, J.W.
;
Jenkins, R.
... - p. 1-4 , 2022
Link:
https://doi.org/10.1109/THERMINIC57263.2022.9950634
RT T1
2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
: T1
Thermal-Hydraulic Characterisation of Electronics Cooling Liquids: A Case Study of Jet Impingement Coldplate on Emulated CPU
UL https://suche.suub.uni-bremen.de/peid=ieee-9950634&Exemplar=1&LAN=DE A1 Murray, G. A1 Elliott, J.W. A1 Jenkins, R. A1 Lebon, M.T. A1 Byrne, G. A1 Robinson, A.J. YR 2022 SN 2474-1523 K1 Water K1 Viscosity K1 Additives K1 Corrosion K1 Thermal engineering K1 Water heating K1 Coolants K1 CPU cooling K1 liquid cooling K1 liquid coldplate K1 fluid properties SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/THERMINIC57263.2022.9950634 DO https://doi.org/10.1109/THERMINIC57263.2022.9950634 SF ELIB - SuUB Bremen
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