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1 Ergebnisse
1
A novel integrated cooling packaging for high power density..:
, In:
2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
,
Al-Hinaai, Amin Salim Obaid
;
Huesgen, Till
;
Buttay, Cyril
.. - p. 1-6 , 2022
Link:
https://doi.org/10.1109/THERMINIC57263.2022.9950643
RT T1 <cTitle>2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)</cTitle>: T1 <Title>A novel integrated cooling packaging for high power density semiconductors</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9950643&Exemplar=1&LAN=DE A1 Al-Hinaai, Amin Salim Obaid A1 Huesgen, Till A1 Buttay, Cyril A1 Zeitler, Richard A1 Meyer, Daniela YR 2022 SN 2474-1523 K1 Power system measurements K1 Density measurement K1 Thermal resistance K1 Merging K1 Packaging K1 Electronic packaging thermal management K1 Power electronics K1 Insulation K1 packaging K1 computational fluid dynamics (CFD) K1 Cooling K1 power electronics K1 high power density SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/THERMINIC57263.2022.9950643 DO https://doi.org/10.1109/THERMINIC57263.2022.9950643 SF ELIB - SuUB Bremen
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