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1
Embedding Solutions for vertical SiC and GaN Power Devices:
, In:
2022 IEEE 9th Workshop on Wide Bandgap Power Devices & Applications (WiPDA)
,
Bach, Hoang Linh
;
Huang, Anqi
;
Teng, Yue
... - p. 99-104 , 2022
Link:
https://doi.org/10.1109/WiPDA56483.2022.9955257
RT T1 <cTitle>2022 IEEE 9th Workshop on Wide Bandgap Power Devices & Applications (WiPDA)</cTitle>: T1 <Title>Embedding Solutions for vertical SiC and GaN Power Devices</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9955257&Exemplar=1&LAN=DE A1 Bach, Hoang Linh A1 Huang, Anqi A1 Teng, Yue A1 Rauh, Hubert A1 Schletz, Andreas A1 Jank, Michael P. M. A1 Marz, Martin YR 2022 SN 2687-8577 K1 Performance evaluation K1 Silicon carbide K1 Bridge circuits K1 Rapid prototyping K1 Ceramics K1 Topology K1 Optimization K1 High performance packages K1 chip embedding K1 WBG packaging K1 high temperature K1 multilayer DBC K1 plug-and-play adaption K1 cost-effective rapid prototyping SP 99 OP 104 LK http://dx.doi.org/https://doi.org/10.1109/WiPDA56483.2022.9955257 DO https://doi.org/10.1109/WiPDA56483.2022.9955257 SF ELIB - SuUB Bremen
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