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1 Ergebnisse
1
A Study of Bonding Materials for GHz Ultrasonic Wavefront C..:
, In:
2022 IEEE International Ultrasonics Symposium (IUS)
,
Chen, Daniel Ssu-Han
;
Sarafianou, Mantalena
;
Wai, Eva Leong Ching
... - p. 1-4 , 2022
Link:
https://doi.org/10.1109/IUS54386.2022.9958758
RT T1
2022 IEEE International Ultrasonics Symposium (IUS)
: T1
A Study of Bonding Materials for GHz Ultrasonic Wavefront Computing
UL https://suche.suub.uni-bremen.de/peid=ieee-9958758&Exemplar=1&LAN=DE A1 Chen, Daniel Ssu-Han A1 Sarafianou, Mantalena A1 Wai, Eva Leong Ching A1 Sharma, Jaibir A1 Lal, Amit A1 Chai, Kevin Tshun Chuan YR 2022 SN 1948-5727 K1 Semiconductor device measurement K1 Transducers K1 Ultrasonic variables measurement K1 Films K1 Sintering K1 Parallel processing K1 Attenuation K1 AIN Transducers K1 BAW-SMR K1 Chip-level Bonding K1 GHz Bulk Acoustic Wave Attenuation K1 Pulse-Echo SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IUS54386.2022.9958758 DO https://doi.org/10.1109/IUS54386.2022.9958758 SF ELIB - SuUB Bremen
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