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Accurate 3DIC thermal simulation for BEOL influence study:

, In: 2022 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA),
Yang, Hao ; Yan, Bin ; Sur, Jianjun... - p. 17-19 , 2022
Link: https://doi.org/10.1109/ICTA56932.2022.9963005