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1 Ergebnisse
1
3D Electromigration Modelling for VLSI:
, In:
2022 IEEE 16th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)
,
Ming Tan, Cher
;
Shabir, Abdul
;
Banerjee, Debraj
- p. 1-4 , 2022
Link:
https://doi.org/10.1109/ICSICT55466.2022.9963434
RT T1
2022 IEEE 16th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)
: T1
3D Electromigration Modelling for VLSI
UL https://suche.suub.uni-bremen.de/peid=ieee-9963434&Exemplar=1&LAN=DE A1 Ming Tan, Cher A1 Shabir, Abdul A1 Banerjee, Debraj YR 2022 K1 Electromigration K1 Solid modeling K1 Temperature distribution K1 Three-dimensional displays K1 Thermomechanical processes K1 Integrated circuit interconnections K1 Very large scale integration SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICSICT55466.2022.9963434 DO https://doi.org/10.1109/ICSICT55466.2022.9963434 SF ELIB - SuUB Bremen
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