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Pre-fabricated High-density TSV Interposer for Programmable..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Ouyang, T. Y. ; Hung, Y. T. ; Lee, O. H.... - p. 1-4 , 2022
Link: https://doi.org/10.1109/IMPACT56280.2022.9966630