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1 Ergebnisse
1
Raman Spectroscopy and Hyperspectral Imaging for Wafer-On-W..:
, In:
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Myalitsin, A.
;
Chen, Z.-W.
;
Araki, N.
... - p. 1-4 , 2022
Link:
https://doi.org/10.1109/IMPACT56280.2022.9966631
RT T1
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
: T1
Raman Spectroscopy and Hyperspectral Imaging for Wafer-On-Wafer (WOW) Processing
UL https://suche.suub.uni-bremen.de/peid=ieee-9966631&Exemplar=1&LAN=DE A1 Myalitsin, A. A1 Chen, Z.-W. A1 Araki, N. A1 Nakamura, T. A1 Fukuda, T. A1 Ohba, T. YR 2022 SN 2150-5942 K1 Micromechanical devices K1 Visualization K1 Silicon devices K1 Manufacturing processes K1 Raman scattering K1 Semiconductor device reliability K1 Imaging K1 Raman spectroscopy K1 hyperspectral imaging K1 3D packaging K1 bumpless build cube K1 wafer thinning SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT56280.2022.9966631 DO https://doi.org/10.1109/IMPACT56280.2022.9966631 SF ELIB - SuUB Bremen
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