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1 Ergebnisse
1
Effects of Corner/Edge Bond and Side-fill for Automotive MC..:
, In:
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Heish, Kuo-Hua
;
Chan, Chao-Chieh
;
Wu, Ming-Jhe
... - p. 1-4 , 2022
Link:
https://doi.org/10.1109/IMPACT56280.2022.9966634
RT T1
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
: T1
Effects of Corner/Edge Bond and Side-fill for Automotive MCM Applications
UL https://suche.suub.uni-bremen.de/peid=ieee-9966634&Exemplar=1&LAN=DE A1 Heish, Kuo-Hua A1 Chan, Chao-Chieh A1 Wu, Ming-Jhe A1 Weng, Chih-Yang A1 Dong, Yu-Da A1 Cheng, Chun-Jen YR 2022 SN 2150-5942 K1 Vibrations K1 Thermal expansion K1 Costs K1 System-in-package K1 Semiconductor device reliability K1 Rheology K1 Process control SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT56280.2022.9966634 DO https://doi.org/10.1109/IMPACT56280.2022.9966634 SF ELIB - SuUB Bremen
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