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1 Ergebnisse
1
Enhanced System Level Channel Characterization Methodology ..:
, In:
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Hsu, Jimmy
;
Wu, Kuan-Ting
;
Ho, Brian
... - p. 1-4 , 2022
Link:
https://doi.org/10.1109/IMPACT56280.2022.9966635
RT T1 <cTitle>2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>Enhanced System Level Channel Characterization Methodology with Seamless Correlation among Hardware, Signal Integrity and Electrical Validation for Design Robustness</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9966635&Exemplar=1&LAN=DE A1 Hsu, Jimmy A1 Wu, Kuan-Ting A1 Ho, Brian A1 Lin, Lemon A1 Chen, Betty A1 Su, Thonas A1 Wu, Steven A1 Hung, Gary A1 Tseng, Jim YR 2022 SN 2150-5942 K1 Micromechanical devices K1 Industries K1 Correlation K1 Phase measurement K1 Debugging K1 Packaging K1 Hardware SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT56280.2022.9966635 DO https://doi.org/10.1109/IMPACT56280.2022.9966635 SF ELIB - SuUB Bremen
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