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1 Ergebnisse
1
Edgebond adhesive enhances the reliability of low-temperatu..:
, In:
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Chang, Simon
;
Lee, Tae-Kyu
;
Li, Wei
... - p. 1-4 , 2022
Link:
https://doi.org/10.1109/IMPACT56280.2022.9966643
RT T1 <cTitle>2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>Edgebond adhesive enhances the reliability of low-temperature solder in board-level assembly (IMPACT 2022)</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9966643&Exemplar=1&LAN=DE A1 Chang, Simon A1 Lee, Tae-Kyu A1 Li, Wei A1 Loh, Karl I. A1 Ibe, Edward S. A1 Wang, Simon YR 2022 SN 2150-5942 K1 Micromechanical devices K1 Temperature K1 Creep K1 Electronics industry K1 Packaging K1 Electronic packaging thermal management K1 Reliability K1 Edgebond K1 Low melting temperature solder K1 thermal cycling K1 Sn-Bi K1 ball shear SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT56280.2022.9966643 DO https://doi.org/10.1109/IMPACT56280.2022.9966643 SF ELIB - SuUB Bremen
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