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1 Ergebnisse
1
A Study of JEDEC Board-Level Drop Test Performance Predicti..:
, In:
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Cheng, Chi-Min
;
Chao, Hsi-Wei
;
Yen, Chu-Chiao
... - p. 1-4 , 2022
Link:
https://doi.org/10.1109/IMPACT56280.2022.9966688
RT T1 <cTitle>2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>A Study of JEDEC Board-Level Drop Test Performance Prediction Trend of BGA Package with SAC1205 Under Different Key Factors</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9966688&Exemplar=1&LAN=DE A1 Cheng, Chi-Min A1 Chao, Hsi-Wei A1 Yen, Chu-Chiao A1 Chiang, Kun-Ting A1 Chang, Wei-Yao A1 Chang, Chia-Wen A1 Chen, Ya-Ping A1 Ho, Hsien-Wei A1 Ko, Chun-Yu A1 Kuo, Chun-Liang YR 2022 SN 2150-5942 K1 Analytical models K1 Temperature K1 Materials reliability K1 Predictive models K1 Packaging K1 Market research K1 Data models SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT56280.2022.9966688 DO https://doi.org/10.1109/IMPACT56280.2022.9966688 SF ELIB - SuUB Bremen
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