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Equivalent Circuit Extraction of Solder Bumps Using a Singl..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Yang, Liang-Yu Ou ; Kao, Chia-Hung - p. 1-2 , 2022
Link: https://doi.org/10.1109/IMPACT56280.2022.9966694