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The Effects of Voids on Solder Joint Reliability in First L..:
, In:
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Lim, Sze Pei
;
Lee, Kor Oon
;
Oi, Kiyoshi
... - p. 1-4 , 2022
Link:
https://doi.org/10.1109/IMPACT56280.2022.9966698
RT T1 <cTitle>2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>The Effects of Voids on Solder Joint Reliability in First Level Interconnect</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9966698&Exemplar=1&LAN=DE A1 Lim, Sze Pei A1 Lee, Kor Oon A1 Oi, Kiyoshi A1 Yeo, Yvonne A1 Sweatman, Keith A1 Ono, Toshiaki A1 Murayama, Kei A1 Martell, Steven R. A1 Shimamoto, Haruo A1 Tsuriya, Masahiro YR 2022 SN 2150-5942 K1 Electromigration K1 Degradation K1 Micromechanical devices K1 Thermal shock K1 Proximity effects K1 Packaging K1 Flip-chip devices SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT56280.2022.9966698 DO https://doi.org/10.1109/IMPACT56280.2022.9966698 SF ELIB - SuUB Bremen
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