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Plasma-Activated Cu-Cu and Al-Al Direct Bonding for Electro..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Hu, Liangxing ; Goh, Simon Chun Kiat ; Lim, Yu Dian... - p. 1-4 , 2022
Link: https://doi.org/10.1109/IMPACT56280.2022.9966710