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1 Ergebnisse
1
Predict the Reliability Life of Wafer Level Packaging using..:
, In:
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Chen, H. L.
;
Chen, B.S.
;
Chiang, K.N.
- p. 1-5 , 2022
Link:
https://doi.org/10.1109/IMPACT56280.2022.9966711
RT T1 <cTitle>2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>Predict the Reliability Life of Wafer Level Packaging using K-Nearest Neighbors algorithm with Cluster Analysis</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9966711&Exemplar=1&LAN=DE A1 Chen, H. L. A1 Chen, B.S. A1 Chiang, K.N. YR 2022 SN 2150-5942 K1 Semiconductor device modeling K1 Semiconductor device reliability K1 Packaging K1 Prediction algorithms K1 Data models K1 Finite element analysis K1 Classification algorithms K1 Wafer Level Package K1 Finite Element Analysis K1 Thermal Cycling Test K1 Reliability Assessment K1 Artificial Intelligence K1 Supervised Learning K1 Unsupervised Learning K1 K-Nearest Neighbors K1 K-means SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT56280.2022.9966711 DO https://doi.org/10.1109/IMPACT56280.2022.9966711 SF ELIB - SuUB Bremen
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