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1 Ergebnisse
1
A Novel Modelling Methodology for Underfill Molding Process..:
, In:
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Liang, Yu En
;
Sun, Chia Peng
;
Hsu, Chih Chung
... - p. 1-4 , 2022
Link:
https://doi.org/10.1109/IMPACT56280.2022.9966712
RT T1 <cTitle>2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>A Novel Modelling Methodology for Underfill Molding Process On 2.2D Heterogeneous Integrated Substrate</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9966712&Exemplar=1&LAN=DE A1 Liang, Yu En A1 Sun, Chia Peng A1 Hsu, Chih Chung A1 Hu, Dyi Chung A1 Chen, Er Hao A1 Lee, Jeffrey Changbing YR 2022 SN 2150-5942 K1 Encapsulation K1 Micromechanical devices K1 Solid modeling K1 Three-dimensional displays K1 Costs K1 Computational modeling K1 Predictive models K1 3D CAE modeling K1 capillary underfill K1 multi-chip package K1 micro bumps K1 dispensing process K1 Equivalent Bump Group (EBG) SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT56280.2022.9966712 DO https://doi.org/10.1109/IMPACT56280.2022.9966712 SF ELIB - SuUB Bremen
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