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1 Ergebnisse
1
Study on Gaussian Process Regression to Predict Reliability..:
, In:
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Chang, C.Y.
;
Chang, H. M.
;
Chiang, K.N.
- p. 1-4 , 2022
Link:
https://doi.org/10.1109/IMPACT56280.2022.9966714
RT T1 <cTitle>2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>Study on Gaussian Process Regression to Predict Reliability Life of Wafer Level Packaging with cluster analysis</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9966714&Exemplar=1&LAN=DE A1 Chang, C.Y. A1 Chang, H. M. A1 Chiang, K.N. YR 2022 SN 2150-5942 K1 Semiconductor device modeling K1 Training K1 Analytical models K1 Semiconductor device reliability K1 Gaussian processes K1 Predictive models K1 Data models K1 Wafer level packaging K1 finite element analysis K1 thermal cycle load K1 reliability estimation K1 machine learning K1 Gaussian regression process K1 Cluster Analysis K1 K-Means SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT56280.2022.9966714 DO https://doi.org/10.1109/IMPACT56280.2022.9966714 SF ELIB - SuUB Bremen
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