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RF Devices Integrated by Fan-Out and System-In-Package Tech..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Kung, Cheng-Yuan ; Lin, Hung-Yi ; Kuo, Chin-Cheng... - p. 1-4 , 2022
Link: https://doi.org/10.1109/IMPACT56280.2022.9966715