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Ultrasonic dispersion of nanocomposite solder for microelec..:
, In:
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Rajendran, Sri Harini
;
Kang, Hyejun
;
Seo, Seong Min
. - p. 1-4 , 2022
Link:
https://doi.org/10.1109/IMPACT56280.2022.9966718
RT T1 <cTitle>2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>Ultrasonic dispersion of nanocomposite solder for microelectronic packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9966718&Exemplar=1&LAN=DE A1 Rajendran, Sri Harini A1 Kang, Hyejun A1 Seo, Seong Min A1 Jung, Jae Pil YR 2022 SN 2150-5942 K1 Nanoparticles K1 Micromechanical devices K1 Microprocessors K1 Printed circuits K1 Packaging K1 Zinc oxide K1 Acoustics SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT56280.2022.9966718 DO https://doi.org/10.1109/IMPACT56280.2022.9966718 SF ELIB - SuUB Bremen
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