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1 Ergebnisse
1
Thermal Design of SiC Power Module for EV/HEV Applications:
, In:
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Liu, Chun-Kai
;
Po-Kai, Chiu
;
Huang, Yuan-Cheng
... - p. 1-4 , 2022
Link:
https://doi.org/10.1109/IMPACT56280.2022.9966722
RT T1 <cTitle>2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>Thermal Design of SiC Power Module for EV/HEV Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9966722&Exemplar=1&LAN=DE A1 Liu, Chun-Kai A1 Po-Kai, Chiu A1 Huang, Yuan-Cheng A1 Syu, Ji-Yuan A1 Chen, Yao-Shun A1 Chou, Yu-An A1 Wu, Kuang-Hung A1 Pan, Wen-Yang YR 2022 SN 2150-5942 K1 Temperature measurement K1 Semiconductor device measurement K1 Power system measurements K1 Power measurement K1 Silicon carbide K1 Thermal resistance K1 Multichip modules SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT56280.2022.9966722 DO https://doi.org/10.1109/IMPACT56280.2022.9966722 SF ELIB - SuUB Bremen
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