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1 Ergebnisse
1
High-speed Data Center PCB Design Challenges and Findings b..:
, In:
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Hsu, Jimmy
;
Hung, Gary
;
Tseng, Jim
... - p. 1-4 , 2022
Link:
https://doi.org/10.1109/IMPACT56280.2022.9966724
RT T1
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
: T1
High-speed Data Center PCB Design Challenges and Findings by Intel ® Automatic In-board Characterization
UL https://suche.suub.uni-bremen.de/peid=ieee-9966724&Exemplar=1&LAN=DE A1 Hsu, Jimmy A1 Hung, Gary A1 Tseng, Jim A1 Ho, Brian A1 Lin, Lemon A1 Su, Thonas YR 2022 SN 2150-5942 K1 Micromechanical devices K1 Drilling K1 Data centers K1 Impedance measurement K1 Packaging K1 Loss measurement K1 Product design SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT56280.2022.9966724 DO https://doi.org/10.1109/IMPACT56280.2022.9966724 SF ELIB - SuUB Bremen
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