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1 Ergebnisse
1
Investigation of Potting Compounds on Thermal-Fatigue prope..:
, In:
IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society
,
Du, Leiming
;
Zhao, Xiujuan
;
Watte, Piet
... - p. 1-5 , 2022
Link:
https://doi.org/10.1109/IECON49645.2022.9968578
RT T1 <cTitle>IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society</cTitle>: T1 <Title>Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9968578&Exemplar=1&LAN=DE A1 Du, Leiming A1 Zhao, Xiujuan A1 Watte, Piet A1 Poelma, Rene A1 Van Driel, Willem A1 Zhang, Guoqi YR 2022 SN 2577-1647 K1 Silver K1 Creep K1 Metals K1 Materials reliability K1 Predictive models K1 Finite element analysis K1 Digital twins K1 solder alloys K1 potting compounds K1 creep K1 thermal-fatigue K1 strain energy density SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/IECON49645.2022.9968578 DO https://doi.org/10.1109/IECON49645.2022.9968578 SF ELIB - SuUB Bremen
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