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1 Ergebnisse
1
Low peel strength investigation in direct gold System in Pa..:
, In:
2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT)
,
Lo, Tsung Nan
;
Liu, Wei
;
Macatangay, Aldy
.. - p. 1-4 , 2022
Link:
https://doi.org/10.1109/IEMT55343.2022.9969472
RT T1
2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT)
: T1
Low peel strength investigation in direct gold System in Package module
UL https://suche.suub.uni-bremen.de/peid=ieee-9969472&Exemplar=1&LAN=DE A1 Lo, Tsung Nan A1 Liu, Wei A1 Macatangay, Aldy A1 Molla, Jaynal A1 Hiew, Pey Fang YR 2022 K1 Gold K1 System-in-package K1 Adhesives K1 Transmission electron microscopy K1 Surface contamination K1 Wires K1 Curing K1 System in Package K1 Peel strength K1 Contamination K1 Cu migration K1 Plasma clean SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IEMT55343.2022.9969472 DO https://doi.org/10.1109/IEMT55343.2022.9969472 SF ELIB - SuUB Bremen
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