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1 Ergebnisse
1
Intermetallic Compound Thickness of Ball Grid Array Solder ..:
, In:
2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT)
,
Ismail, Adlil Aizat
;
Bakar, Maria Abu
;
Ehsan, Abang Annuar
... - p. 1-4 , 2022
Link:
https://doi.org/10.1109/IEMT55343.2022.9969477
RT T1 <cTitle>2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT)</cTitle>: T1 <Title>Intermetallic Compound Thickness of Ball Grid Array Solder Joints Under Thermal Cycling Test Using ANOVA</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9969477&Exemplar=1&LAN=DE A1 Ismail, Adlil Aizat A1 Bakar, Maria Abu A1 Ehsan, Abang Annuar A1 Jalar, Azman A1 Basiron, Erwan A1 Ani, Fakhrozi Che YR 2022 K1 Temperature measurement K1 Thermal expansion K1 Loading K1 Thermal analysis K1 Thermal loading K1 Intermetallic K1 Compounds K1 intermetallic compound (IMC) K1 ANOVA K1 Ball grid array (BGA) K1 thermal cycling test (TCT) K1 reliability SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IEMT55343.2022.9969477 DO https://doi.org/10.1109/IEMT55343.2022.9969477 SF ELIB - SuUB Bremen
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