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1 Ergebnisse
1
Effects of Underfill Materials on Behavior of Intermetallic..:
, In:
2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT)
,
Ismail, Adlil Aizat
;
Bakar, Maria Abu
;
Ehsan, Abang Annuar
... - p. 1-5 , 2022
Link:
https://doi.org/10.1109/IEMT55343.2022.9969487
RT T1 <cTitle>2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT)</cTitle>: T1 <Title>Effects of Underfill Materials on Behavior of Intermetallic Compound Thickness of Ball Grid Array Solder Joints Using ANOVA</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9969487&Exemplar=1&LAN=DE A1 Ismail, Adlil Aizat A1 Bakar, Maria Abu A1 Ehsan, Abang Annuar A1 Jalar, Azman A1 Ani, Fakhrozi Che A1 Zolkefli, Zol Effendi YR 2022 K1 Heating systems K1 Error analysis K1 Sociology K1 Materials reliability K1 Manufacturing K1 Intermetallic K1 Compounds K1 intermetallic compound (IMe) K1 ANOVA K1 underfill K1 ball grid array (BGA) K1 thermal cycling test SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/IEMT55343.2022.9969487 DO https://doi.org/10.1109/IEMT55343.2022.9969487 SF ELIB - SuUB Bremen
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