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Detailed Analysis of Conductive Die Attach Film in Miniatur..:

, In: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT),
Wan, Meng Fatt ; Chiew, Ying Heong ; Tey, Yong Yuen - p. 1-5 , 2022
Link: https://doi.org/10.1109/IEMT55343.2022.9969492