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1 Ergebnisse
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Correlation Study Between Pure Tin Plating Intermetallic An..:
, In:
2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT)
,
Salleh, Ronizan Mohd
;
Idris, Rasli
;
Foong, Lim Koo
. - p. 1-5 , 2022
Link:
https://doi.org/10.1109/IEMT55343.2022.9969498
RT T1
2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT)
: T1
Correlation Study Between Pure Tin Plating Intermetallic And Grain Size
UL https://suche.suub.uni-bremen.de/peid=ieee-9969498&Exemplar=1&LAN=DE A1 Salleh, Ronizan Mohd A1 Idris, Rasli A1 Foong, Lim Koo A1 De Castro, Salazar Esperidion YR 2022 K1 Grain size K1 Chemistry K1 Correlation K1 Copper alloys K1 Tin K1 Plating K1 Lead K1 Pure tin plating K1 intermetallic K1 grain size SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/IEMT55343.2022.9969498 DO https://doi.org/10.1109/IEMT55343.2022.9969498 SF ELIB - SuUB Bremen
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