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1 Ergebnisse
1
Investigation of Solder Void Improvement on Automotive Part:
, In:
2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT)
,
Brian, Aranas Guadalquever
;
Chinathamby, Pavendhran
;
Chaw, Wing Onn
. - p. 1-3 , 2022
Link:
https://doi.org/10.1109/IEMT55343.2022.9969499
RT T1 <cTitle>2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT)</cTitle>: T1 <Title>Investigation of Solder Void Improvement on Automotive Parts</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9969499&Exemplar=1&LAN=DE A1 Brian, Aranas Guadalquever A1 Chinathamby, Pavendhran A1 Chaw, Wing Onn A1 Chang, Ting Wei YR 2022 K1 Resistance K1 Ovens K1 Electronics industry K1 Process control K1 High-voltage techniques K1 Behavioral sciences K1 Manufacturing K1 Solder Void K1 Vacuum Reflow Oven SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/IEMT55343.2022.9969499 DO https://doi.org/10.1109/IEMT55343.2022.9969499 SF ELIB - SuUB Bremen
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