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1 Ergebnisse
1
A Via/Contact Layout Decomposition Method for Directed Self..:
, In:
2022 International Workshop on Advanced Patterning Solutions (IWAPS)
,
Zhou, Hengyu
;
Zhang, Tao
;
Li, Sikun
... - p. 1-4 , 2022
Link:
https://doi.org/10.1109/IWAPS57146.2022.9972306
RT T1 <cTitle>2022 International Workshop on Advanced Patterning Solutions (IWAPS)</cTitle>: T1 <Title>A Via/Contact Layout Decomposition Method for Directed Self-Assembly Based on Local Optimization</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9972306&Exemplar=1&LAN=DE A1 Zhou, Hengyu A1 Zhang, Tao A1 Li, Sikun A1 Tang, Ming A1 Xiong, Shisheng A1 Wang, Xiangzhao YR 2022 K1 Self-assembly K1 Simulation K1 Conferences K1 Layout K1 Lithography K1 Optimization K1 Pattern matching K1 DSA K1 Local Optimization K1 Maximal Cardinality Matching K1 Uniform Coloring SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IWAPS57146.2022.9972306 DO https://doi.org/10.1109/IWAPS57146.2022.9972306 SF ELIB - SuUB Bremen
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