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1 Ergebnisse
1
Challenges for High Volume Testing of Embedded IO Interface..:
, In:
2022 IEEE International Test Conference (ITC)
,
Garita-Rodriguez, Esteban
;
Rimolo-Donadio, Renato
;
Zamora-Salazar, Rafael
- p. 456-464 , 2022
Link:
https://doi.org/10.1109/ITC50671.2022.00053
RT T1
2022 IEEE International Test Conference (ITC)
: T1
Challenges for High Volume Testing of Embedded IO Interfaces in Disaggregated Microprocessor Products
UL https://suche.suub.uni-bremen.de/peid=ieee-9983881&Exemplar=1&LAN=DE A1 Garita-Rodriguez, Esteban A1 Rimolo-Donadio, Renato A1 Zamora-Salazar, Rafael YR 2022 SN 2378-2250 K1 Industries K1 Three-dimensional displays K1 Microprocessors K1 Semiconductor device reliability K1 Process control K1 Production K1 Packaging K1 chip disaggregation K1 design for test K1 embedded IO K1 final package test K1 heterogeneous integration K1 high-volume manufacturing K1 wafer level test SP 456 OP 464 LK http://dx.doi.org/https://doi.org/10.1109/ITC50671.2022.00053 DO https://doi.org/10.1109/ITC50671.2022.00053 SF ELIB - SuUB Bremen
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