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1 Ergebnisse
1
Thermal Resistance Measurements Method for Press-pack Power..:
, In:
2022 IEEE 5th International Conference on Automation, Electronics and Electrical Engineering (AUTEEE)
,
Zhang, Haitao
;
Yang, Liu
;
Yu, Qiong
.. - p. 321-325 , 2022
Link:
https://doi.org/10.1109/AUTEEE56487.2022.9994334
RT T1 <cTitle>2022 IEEE 5th International Conference on Automation, Electronics and Electrical Engineering (AUTEEE)</cTitle>: T1 <Title>Thermal Resistance Measurements Method for Press-pack Power Devices</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9994334&Exemplar=1&LAN=DE A1 Zhang, Haitao A1 Yang, Liu A1 Yu, Qiong A1 Wen, Jun A1 Liu, Chunquan YR 2022 SN 2831-4549 K1 Temperature measurement K1 Insulated gate bipolar transistors K1 Temperature distribution K1 Voltage measurement K1 Thermal resistance K1 Thermal conductivity K1 Mathematical models K1 press-pack device K1 thermal resistance measurement K1 temperature field K1 junction-case thermal resistance SP 321 OP 325 LK http://dx.doi.org/https://doi.org/10.1109/AUTEEE56487.2022.9994334 DO https://doi.org/10.1109/AUTEEE56487.2022.9994334 SF ELIB - SuUB Bremen
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