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1 Ergebnisse
1
Thermal Analysis of DDR5 DIMM with Forced Air Cooling Metho:
, In:
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
,
Son, Keeyoung
;
Lho, Daehwan
;
Kim, Seongguk
... - p. 1-3 , 2022
Link:
https://doi.org/10.1109/EDAPS56906.2022.9994998
RT T1 <cTitle>2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)</cTitle>: T1 <Title>Thermal Analysis of DDR5 DIMM with Forced Air Cooling Method</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9994998&Exemplar=1&LAN=DE A1 Son, Keeyoung A1 Lho, Daehwan A1 Kim, Seongguk A1 Park, Joonsang A1 Kim, Keunwoo A1 Choi, Namhyeon A1 Kim, Hyunsik A1 Kim, Joungho YR 2022 SN 2151-1233 K1 Power system measurements K1 Three-dimensional displays K1 Cooling K1 System performance K1 Power system management K1 Thermal management K1 Thermal force K1 DDR5 K1 DIMM K1 Forced air cooling K1 PMIC K1 Reliability K1 Thermal gradient SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/EDAPS56906.2022.9994998 DO https://doi.org/10.1109/EDAPS56906.2022.9994998 SF ELIB - SuUB Bremen
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