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1 Ergebnisse
1
Design and Analysis of Hierarchical Power Distribution Netw..:
, In:
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
,
Kim, Hyunwoo
;
Kim, Haeyeon
;
Park, Joonsang
... - p. 1-3 , 2022
Link:
https://doi.org/10.1109/EDAPS56906.2022.9995183
RT T1 <cTitle>2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)</cTitle>: T1 <Title>Design and Analysis of Hierarchical Power Distribution Network (PDN) for Full Wafer Scale Chip (FWSC) Module</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9995183&Exemplar=1&LAN=DE A1 Kim, Hyunwoo A1 Kim, Haeyeon A1 Park, Joonsang A1 Son, Keeyoung A1 Park, Hyunwook A1 Shin, Taein A1 Kim, Keunwoo A1 Yoon, Jiwon A1 Lee, Junghyun A1 Hong, Jonghyun A1 Kim, Juneyoung A1 Kim, Joungho YR 2022 SN 2151-1233 K1 Semiconductor device modeling K1 Three-dimensional displays K1 Sockets K1 Packaging K1 Power systems K1 System-on-chip K1 Rubber K1 Full wafer scale chip module K1 power distribution network K1 silicone rubber socket K1 through wafer via SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/EDAPS56906.2022.9995183 DO https://doi.org/10.1109/EDAPS56906.2022.9995183 SF ELIB - SuUB Bremen
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