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An Approach of Designing High Angular Resolution Virtual MI..:

, In: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS),
Liao, Xing ; Liu, Kuayue ; Wan, Qingmian.. - p. 1-3 , 2022
Link: https://doi.org/10.1109/EDAPS56906.2022.9995351