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1 Ergebnisse
1
Power Distribution Network Impedance Analysis considering T..:
, In:
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
,
Son, Keeyoung
;
Lho, Daehwan
;
Kim, Keunwoo
... - p. 1-3 , 2022
Link:
https://doi.org/10.1109/EDAPS56906.2022.9995613
RT T1 <cTitle>2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)</cTitle>: T1 <Title>Power Distribution Network Impedance Analysis considering Thermal Distribution</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9995613&Exemplar=1&LAN=DE A1 Son, Keeyoung A1 Lho, Daehwan A1 Kim, Keunwoo A1 Choi, Seonguk A1 Kim, Haeyeon A1 Park, Hyunwook A1 Sim, Boogyo A1 Kim, Hyunwoo A1 Shin, Taein A1 Kim, Joungho YR 2022 SN 2151-1233 K1 Temperature distribution K1 Power system measurements K1 Low voltage K1 Density measurement K1 Thermal resistance K1 Voltage K1 Packaging K1 Impedance K1 Power distribution network K1 Power integrity K1 Thermal distribution SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/EDAPS56906.2022.9995613 DO https://doi.org/10.1109/EDAPS56906.2022.9995613 SF ELIB - SuUB Bremen
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