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>110 GHz High-Power Photodiode by Flip-Chip Bonding:

, In: 2022 IEEE International Topical Meeting on Microwave Photonics (MWP),
Wei, Chao ; Xie, Xiaojun ; Du, Yongtao... - p. 1-4 , 2022
Link: https://doi.org/10.1109/MWP54208.2022.9997642