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The Thermal Expansion of Copper at Low Temperatures:

Carr, R. H. ; McCammon, R. D. ; White, G. K.
Proceedings of the Royal Society of London. Series A, Mathematical and Physical Sciences. 280 (1964) 1380 - p. 72-84 , 1964

Link: https://www.jstor.org/stable/2414873

RT Journal
T1 <Title>The Thermal Expansion of Copper at Low Temperatures</Title>

UL https://suche.suub.uni-bremen.de/peid=jstor-2414873&Exemplar=1&LAN=DE
				
A1 Carr, R. H.
A1 McCammon, R. D.
A1 White, G. K.
PB The Royal Society
YR 1964
SN 0080-4630
K1 Physical sciences
K1 Chemistry
K1 Chemical elements
K1 Transition metals
K1 Copper
K1 Physics
K1 Thermodynamics
K1 Thermal analysis
K1 Temperature
K1 Low temperature
K1 Applied sciences
K1 Materials science
K1 Material properties
K1 Electrical properties
K1 Capacitance
K1 Mathematics
K1 Pure mathematics
K1 Algebra
K1 Coefficients
K1 Thermodynamic expansion
K1 Thermal expansion
K1 Room temperature
K1 Heat
K1 Specific heat
K1 Engineering
K1 Electrical engineering
K1 Electronic components
K1 Passive components
K1 Capacitors
K1 Earth sciences
K1 Geology
K1 Mineralogy
K1 Specimens
K1 Metalloids
K1 Germanium
JF Proceedings of the Royal Society of London. Series A, Mathematical and Physical Sciences
VO 280
IS 1380
SP 72
OP 84
LK http://dx.doi.org/https://www.jstor.org/stable/2414873
DO https://www.jstor.org/stable/2414873
SF ELIB - SuUB Bremen

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