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1 Ergebnisse
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Investigating the Performance and Reliability of Au-Sn Bond..:
Yin, Luqiao
;
Zhou, Haojie
;
Ji, Xiaoxiao
...
IEEE Transactions on Electron Devices. 71 (2024) 3 - p. 1999-2004 , 2024
Link:
https://doi.org/10.1109/ted.2024.3358782
RT Journal T1 <Title>Investigating the Performance and Reliability of Au-Sn Bonded Flip-Chip Micro-LEDs</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_ted.2024.3358782&Exemplar=1&LAN=DE A1 Yin, Luqiao A1 Zhou, Haojie A1 Ji, Xiaoxiao A1 Li, Jianxin A1 Wang, Kefeng A1 Li, Chunya A1 Zhang, Jianhua PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 0018-9383 SN 1557-9646 JF IEEE Transactions on Electron Devices VO 71 IS 3 SP 1999 OP 2004 LK http://dx.doi.org/https://doi.org/10.1109/ted.2024.3358782 DO https://doi.org/10.1109/ted.2024.3358782 SF ELIB - SuUB Bremen
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